Intermetallic Phase Formation and Thickness of Tin- Zinc Based Lead-free Solders
نویسندگان
چکیده
In this study the intermetallic (IMC) thickness of Sn-Pb, Sn-Zn and Sn-Zn-Bi solders on copper (Cu) substrate were measured at different temperatures using reflow methods. Cu6Sn5 intermetallic phase was detected between Sn-Pb solder and Cu substrate. The -Cu5Zn8 phase was detected between Sn-Zn and Sn-Zn-Bi lead-free solders with Cu substrate. The thickness of the intermetallics increases with temperature. The IMC thickness for Sn-8Zn-3Bi solder is lower than Sn-9Zn solder for all the soldering temperatures, indicating that Bi has suppressed the initial IMC formation.
منابع مشابه
Investigation of microstructure and physical properties in nanocomposite solder reinforced with various percent of graphene nanosheets (SAC0307+GNSs)
Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions ...
متن کاملInvestigation of microstructure and physical properties in nanocomposite solder reinforced with various percent of graphene nanosheets (SAC0307+GNSs)
Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions ...
متن کاملTin whisker growth on bulk Sn-Pb eutectic doping with Nd
Tin whisker growth is a serious reliability concern for electronics using high-density packaging. Whisker growth behavior of tin lead eutectic solders doped with different neodymium concentration (5–0.1wt.%) was studied in present work. Results indicate that the Nd in the all of the Sn–Pb–Nd alloys mainly exists in NdSn3 intermetallic compound, and that the distribution of the NdSn3 phase is ve...
متن کاملInterfacial fracture toughness of Pb-free solders
Increasing environmental concerns and pending government regulations have pressured microelectronic manufacturers to find suitable alternatives to Pb-bearing solders traditionally used in electronics packaging. Over recent years, Sn-rich solders have received significant attention as suitable replacements for Pbbearing solders. Understanding the behavior of intermetallics in Sn-rich solders is ...
متن کاملInfluence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions
Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn-Ag-Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermet...
متن کامل